Part Details for M1AFS600-1FGG484YI by Microsemi Corporation
Overview of M1AFS600-1FGG484YI by Microsemi Corporation
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Part Details for M1AFS600-1FGG484YI
M1AFS600-1FGG484YI CAD Models
M1AFS600-1FGG484YI Part Data Attributes
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M1AFS600-1FGG484YI
Microsemi Corporation
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M1AFS600-1FGG484YI
Microsemi Corporation
Field Programmable Gate Array,
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | FPBGA-256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Additional Feature | TERM PITCH-MIN | |
Clock Frequency-Max | 350 MHz | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Equivalent Gates | 600000 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 600000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Seated Height-Max | 1.7 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |