Datasheets
LX5535LQ-TR by:
Microchip Technology Inc
Microchip Technology Inc
Microsemi Corporation
Not Found

2.4G PA 3.3-5V 3x3x0.9

Part Details for LX5535LQ-TR by Microchip Technology Inc

Results Overview of LX5535LQ-TR by Microchip Technology Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

LX5535LQ-TR Information

LX5535LQ-TR by Microchip Technology Inc is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for LX5535LQ-TR

Part # Distributor Description Stock Price Buy
Future Electronics LX5535 Series 2.5 GHz 5 V RF Chip Single Power Amp - MLPQ-16 RoHS: Compliant pbFree: Yes Min Qty: 3000 Package Multiple: 3000 Container: Reel 0
Reel
  • 3,000 $0.6750
$0.6750 Buy Now
NAC 2.4G PA, 3.3-5V, 3x3x0.9, 16 VQFN 3x3x1.0mm T/R RoHS: Compliant Min Qty: 1 Package Multiple: 1 0
RFQ
DISTI # LX5535LQ-TR
Avnet Silica RF Amp Chip Single Power Amp 2500MHz 5V 16Pin MLPQ TR (Alt: LX5535LQ-TR) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Silica - 0
Buy Now
DISTI # LX5535LQ-TR
EBV Elektronik RF Amp Chip Single Power Amp 2500MHz 5V 16Pin MLPQ TR (Alt: LX5535LQ-TR) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now

Part Details for LX5535LQ-TR

LX5535LQ-TR CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

LX5535LQ-TR Part Data Attributes

LX5535LQ-TR Microchip Technology Inc
Buy Now Datasheet
Compare Parts:
LX5535LQ-TR Microchip Technology Inc 2.4G PA 3.3-5V 3x3x0.9
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer Microchip
Characteristic Impedance 50 Ω
Construction COMPONENT
Gain 32 dB
Input Power-Max (CW) 15 dBm
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Functions 1
Number of Terminals 16
Operating Frequency-Max 2500 MHz
Operating Frequency-Min 2400 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Equivalence Code LCC16,.12SQ,20
Power Supplies 5 V
RF/Microwave Device Type NARROW BAND MEDIUM POWER
Surface Mount YES
Technology HYBRID
Terminal Finish Matte Tin (Sn)
VSWR-Max 1.92

Alternate Parts for LX5535LQ-TR

This table gives cross-reference parts and alternative options found for LX5535LQ-TR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LX5535LQ-TR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MGA-22003-TR2 Avago Technologies Check for Price SPECIALTY TELECOM CIRCUIT LX5535LQ-TR vs MGA-22003-TR2
MGA-22003-BLKG Avago Technologies Check for Price 2300MHz - 2700MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER, 3 X 3 MM, 1 MM HEIGHT, SMT-16 LX5535LQ-TR vs MGA-22003-BLKG
LX5535LQ Microchip Technology Inc Check for Price RF/Microwave Amplifier LX5535LQ-TR vs LX5535LQ

LX5535LQ-TR Related Parts

LX5535LQ-TR Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.

  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, and use a ferrite bead or inductor to filter out high-frequency noise.

  • Use a high-quality, low-jitter clock source (e.g., a crystal oscillator) and ensure the clock signal is properly terminated and routed. Avoid using long clock traces and keep the clock signal away from noisy digital signals.

  • Use a high-quality, low-noise analog power supply, and ensure the analog input signals are properly filtered and terminated. Keep the analog section separate from the digital section, and use a common ground point for the analog and digital grounds.

  • Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Avoid blocking airflow or using a heat sink with high thermal resistance. Monitor the device temperature and adjust the thermal management strategy accordingly.