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Drivers And Interfaces / Line Driver or Receivers / LTM2881HY-3
Datasheets
LTM2881HY-3 by:
Linear Technology
Analog Devices Inc
Linear Technology
Not Found

LTM2881 - Complete Isolated RS485/RS422 µModule Transceiver + Power; Package: BGA; Pins: 32; Temperature Range: -40°C to 125°C

Part Details for LTM2881HY-3 by Linear Technology

Results Overview of LTM2881HY-3 by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Energy and Power Systems Healthcare Transportation and Logistics Renewable Energy Telecommunications Automotive

LTM2881HY-3 Information

LTM2881HY-3 by Linear Technology is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for LTM2881HY-3

Part # Distributor Description Stock Price Buy
Vyrian Interface ICs 1391
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Part Details for LTM2881HY-3

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LTM2881HY-3 Part Data Attributes

Parametric Data
LTM2881HY-3 Linear Technology
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LTM2881HY-3 Linear Technology LTM2881 - Complete Isolated RS485/RS422 µModule Transceiver + Power; Package: BGA; Pins: 32; Temperature Range: -40°C to 125°C
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Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code BGA
Package Description BGA-32
Pin Count 32
Manufacturer Package Code BGA
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Differential Output YES
Driver Number of Bits 1
Input Characteristics DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE TRANSCEIVER
Interface Standard EIA-485-A; TIA-485-A; EIA-422
JESD-30 Code R-PBGA-B32
JESD-609 Code e0
Length 15 mm
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Receive Delay-Max 140 ns
Receiver Number of Bits 1
Seated Height-Max 3.62 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 1.62 V
Supply Voltage-Nom 3.3 V
Supply Voltage1-Max 3.6 V
Supply Voltage1-Min 3 V
Supply Voltage1-Nom 3.3 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Transmit Delay-Max 1550 ns
Width 11.25 mm

LTM2881HY-3 Related Parts

LTM2881HY-3 Frequently Asked Questions (FAQ)

  • A good PCB layout for the LTM2881HY-3 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals.

  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, the device should be operated within its specified temperature range.

  • Operating the LTM2881HY-3 at a lower input voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential instability. Operating at a higher input voltage may result in increased power consumption, heat generation, and potentially damage the device. It's recommended to operate the device within the specified input voltage range.

  • To troubleshoot issues with the I2C interface, check the I2C bus voltage levels, ensure proper termination, and verify that the clock frequency is within the specified range. Additionally, use an oscilloscope to monitor the I2C bus signals and check for any bus contention or noise issues.

  • To minimize EMI and RFI issues, use a shielded enclosure, keep the device away from radiating sources, and use a low-pass filter on the input power lines. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is operated within its specified frequency range.