Datasheets
LTC2656BIUFD-H16#TRPBF by:
Linear Technology
Analog Devices Inc
Linear Technology
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LTC2656 - Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: QFN; Pins: 20; Temperature Range: -40°C to 85°C

Part Details for LTC2656BIUFD-H16#TRPBF by Linear Technology

Results Overview of LTC2656BIUFD-H16#TRPBF by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

LTC2656BIUFD-H16#TRPBF Information

LTC2656BIUFD-H16#TRPBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for LTC2656BIUFD-H16#TRPBF

Part # Distributor Description Stock Price Buy
Vyrian Converters 269
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Part Details for LTC2656BIUFD-H16#TRPBF

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LTC2656BIUFD-H16#TRPBF Part Data Attributes

LTC2656BIUFD-H16#TRPBF Linear Technology
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LTC2656BIUFD-H16#TRPBF Linear Technology LTC2656 - Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: QFN; Pins: 20; Temperature Range: -40°C to 85°C
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code QFN
Package Description 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20
Pin Count 20
Manufacturer Package Code UFD
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Output Voltage-Max 4.096 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code R-PQCC-N20
JESD-609 Code e3
Length 5 mm
Linearity Error-Max (EL) 0.0061%
Moisture Sensitivity Level 1
Number of Bits 16
Number of Functions 1
Number of Terminals 20
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC20,.16X.2,20
Package Shape RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Settling Time-Nom (tstl) 7.9 µs
Supply Current-Max 4.25 mA
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm

Alternate Parts for LTC2656BIUFD-H16#TRPBF

This table gives cross-reference parts and alternative options found for LTC2656BIUFD-H16#TRPBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTC2656BIUFD-H16#TRPBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LTC2656BIUFD-H16#TRPBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BIUFD-H16#TRPBF vs LTC2656BIUFD-H16#TRPBF
LTC2656BIUFD-H16#PBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BIUFD-H16#TRPBF vs LTC2656BIUFD-H16#PBF
LTC2656BCUFD-H16#TRPBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BIUFD-H16#TRPBF vs LTC2656BCUFD-H16#TRPBF

LTC2656BIUFD-H16#TRPBF Related Parts

LTC2656BIUFD-H16#TRPBF Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the LTC2656BIUFD-H16#TRPBF can be found in the Linear Technology application note AN140, which provides guidelines for PCB layout, component placement, and thermal management to ensure optimal performance and reliability.

  • The LTC2656BIUFD-H16#TRPBF has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal management. The application note AN140 provides more detailed information on thermal management.

  • The recommended input capacitance is 10uF to 22uF, and the recommended output capacitance is 10uF to 47uF. However, the optimal capacitance values may vary depending on the specific application and operating conditions. It is recommended to consult the datasheet and application notes for more information.

  • The LTC2656BIUFD-H16#TRPBF is a digitally controlled potentiometer, and it can be programmed using a serial interface such as I2C or SPI. The programming interface and commands are described in the datasheet and application notes. A programming guide is also available from Linear Technology.

  • The maximum operating temperature range for the LTC2656BIUFD-H16#TRPBF is -40°C to 125°C. However, the device may not operate within specifications at the extreme temperatures, and derating may be necessary. Consult the datasheet for more information on operating temperature range and derating.