Datasheets
LTC2656BCUFD-H16#PBF by:
Linear Technology
Analog Devices Inc
Linear Technology
Not Found

LTC2656 - Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: QFN; Pins: 20; Temperature Range: 0°C to 70°C

Part Details for LTC2656BCUFD-H16#PBF by Linear Technology

Results Overview of LTC2656BCUFD-H16#PBF by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

LTC2656BCUFD-H16#PBF Information

LTC2656BCUFD-H16#PBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for LTC2656BCUFD-H16#PBF

Part # Distributor Description Stock Price Buy
Vyrian Converters 182
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Part Details for LTC2656BCUFD-H16#PBF

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LTC2656BCUFD-H16#PBF Part Data Attributes

LTC2656BCUFD-H16#PBF Linear Technology
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LTC2656BCUFD-H16#PBF Linear Technology LTC2656 - Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: QFN; Pins: 20; Temperature Range: 0°C to 70°C
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code QFN
Package Description 4 X 5 MM, LEAD FREE, PLASTIC, MO-220, QFN-20
Pin Count 20
Manufacturer Package Code UFD
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Output Voltage-Max 4.096 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code R-PQCC-N20
JESD-609 Code e3
Length 5 mm
Linearity Error-Max (EL) 0.0061%
Moisture Sensitivity Level 1
Number of Bits 16
Number of Functions 1
Number of Terminals 20
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC20,.16X.2,20
Package Shape RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Settling Time-Nom (tstl) 7.9 µs
Supply Current-Max 4.25 mA
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 4 mm

Alternate Parts for LTC2656BCUFD-H16#PBF

This table gives cross-reference parts and alternative options found for LTC2656BCUFD-H16#PBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTC2656BCUFD-H16#PBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LTC2656BIUFD-H16#TRPBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BCUFD-H16#PBF vs LTC2656BIUFD-H16#TRPBF
LTC2656BIUFD-H16#PBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BCUFD-H16#PBF vs LTC2656BIUFD-H16#PBF
LTC2656BCUFD-H16#TRPBF Analog Devices Inc Check for Price Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference LTC2656BCUFD-H16#PBF vs LTC2656BCUFD-H16#TRPBF
LTC2656BIUFD-H16#TRPBF Linear Technology Check for Price LTC2656 - Octal 16-/12-Bit Rail-to-Rail DACs with 10ppm/°C Max Reference; Package: QFN; Pins: 20; Temperature Range: -40°C to 85°C LTC2656BCUFD-H16#PBF vs LTC2656BIUFD-H16#TRPBF

LTC2656BCUFD-H16#PBF Frequently Asked Questions (FAQ)

  • The datasheet provides some guidelines, but it's recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and place the device close to the power supply. Additionally, use a solid ground plane and avoid routing digital signals near analog signals.

  • Calibration involves setting the internal voltage reference and trimming the DAC output. Follow the calibration procedure outlined in the datasheet, and consider using the LTspice simulation tool to model and optimize your design.

  • The device has a maximum junction temperature of 150°C. Ensure good thermal conduction by using a heat sink or thermal pad, and follow the recommended PCB layout guidelines. Also, consider the thermal resistance of the package and the PCB material.

  • The POR and BOR functions ensure the device resets properly during power-up and brown-out conditions. Connect the POR pin to a capacitor and a pull-up resistor, and ensure the BOR threshold is set correctly for your application.

  • Use a shielded enclosure, keep the device away from antennas and high-frequency sources, and use a common-mode choke or ferrite bead to filter the power supply. Also, follow good PCB design practices, such as using a solid ground plane and minimizing signal loop areas.