Datasheets
LTC2626CDD#PBF by:
Linear Technology
Analog Devices Inc
Linear Technology
Not Found

LTC2626 - 12-Bit Rail-to-Rail DACs with I<sup>2</sup>C Interface; Package: DFN; Pins: 10; Temperature Range: 0&deg;C to 70&deg;C

Part Details for LTC2626CDD#PBF by Linear Technology

Results Overview of LTC2626CDD#PBF by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

LTC2626CDD#PBF Information

LTC2626CDD#PBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Price & Stock for LTC2626CDD#PBF

Part # Distributor Description Stock Price Buy
Vyrian Converters 173
RFQ
Win Source Electronics IC DAC 12BIT I2C V-OUT 10-DFN 1642
  • 4 $15.3080
  • 8 $12.5605
  • 13 $12.1679
  • 17 $11.7754
  • 22 $11.3829
  • 30 $10.2054
$10.2054 / $15.3080 Buy Now

Part Details for LTC2626CDD#PBF

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LTC2626CDD#PBF Part Data Attributes

LTC2626CDD#PBF Linear Technology
Buy Now Datasheet
Compare Parts:
LTC2626CDD#PBF Linear Technology LTC2626 - 12-Bit Rail-to-Rail DACs with I<sup>2</sup>C Interface; Package: DFN; Pins: 10; Temperature Range: 0&deg;C to 70&deg;C
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code DFN
Package Description DFN-10
Pin Count 10
Manufacturer Package Code DD
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Output Voltage-Max 5.5 V
Analog Output Voltage-Min
Converter Type D/A CONVERTER
Input Bit Code BINARY
Input Format SERIAL
JESD-30 Code S-PDSO-N10
JESD-609 Code e3
Length 3 mm
Linearity Error-Max (EL) 0.0977%
Moisture Sensitivity Level 1
Number of Bits 12
Number of Functions 1
Number of Terminals 10
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code HVSON
Package Equivalence Code SOLCC10,.11,20
Package Shape SQUARE
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Settling Time-Nom (tstl) 7 µs
Supply Current-Max 0.5 mA
Supply Voltage-Nom 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

Alternate Parts for LTC2626CDD#PBF

This table gives cross-reference parts and alternative options found for LTC2626CDD#PBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTC2626CDD#PBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LTC2626CDD Analog Devices Inc Check for Price D/A Converter, 1 Func, Serial Input Loading, 7us Settling Time, PDSO10 LTC2626CDD#PBF vs LTC2626CDD
LTC2626IDD Linear Technology Check for Price LTC2626 - 12-Bit Rail-to-Rail DACs with I2C Interface; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C LTC2626CDD#PBF vs LTC2626IDD
LTC2626CDD Linear Technology Check for Price LTC2626 - 12-Bit Rail-to-Rail DACs with I2C Interface; Package: DFN; Pins: 10; Temperature Range: 0°C to 70°C LTC2626CDD#PBF vs LTC2626CDD
LTC2626IDD Analog Devices Inc Check for Price D/A Converter, 1 Func, Serial Input Loading, 7us Settling Time, PDSO10 LTC2626CDD#PBF vs LTC2626IDD
LTC2626IDD#PBF Linear Technology Check for Price LTC2626 - 12-Bit Rail-to-Rail DACs with I2C Interface; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C LTC2626CDD#PBF vs LTC2626IDD#PBF
LTC2626CDD#PBF Analog Devices Inc $4.4498 12-Bit Rail-to-Rail DACs with I2C Interface LTC2626CDD#PBF vs LTC2626CDD#PBF

LTC2626CDD#PBF Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the LTC2626CDD involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the digital signals away from the analog signals.

  • To optimize the performance of the LTC2626CDD, it's recommended to follow the application notes and design guidelines provided by Linear Technology. This includes selecting the appropriate input range, gain, and output voltage, as well as optimizing the PCB layout and component selection. Additionally, it's recommended to use the device's built-in calibration features and to consider using external filters or amplifiers to improve performance.

  • The LTC2626CDD's built-in calibration features are limited to correcting for offset and gain errors. They do not correct for non-linearity or other types of errors. Additionally, the calibration features may not be able to correct for errors introduced by external components or PCB layout issues. It's recommended to carefully evaluate the device's performance and consider using external calibration or correction techniques if necessary.

  • To ensure the reliability and ruggedness of the LTC2626CDD, it's recommended to follow proper design and manufacturing practices, such as using a robust PCB design, selecting high-quality components, and following proper soldering and assembly techniques. Additionally, it's recommended to consider using protective devices such as TVS diodes or surge protectors to protect the device from overvoltage and ESD events.

  • The LTC2626CDD has a maximum junction temperature of 150°C, and it's recommended to keep the device below 125°C for optimal performance and reliability. It's also recommended to provide adequate heat sinking and thermal management to prevent overheating, especially in high-power or high-temperature applications.