Datasheets
LTC2378IMS-16#PBF by:
Linear Technology
Analog Devices Inc
Linear Technology
Not Found

LTC2378-16 - 16-Bit, 1Msps, Low Power SAR ADC with 97dB SNR; Package: MSOP; Pins: 16; Temperature Range: -40°C to 85°C

Part Details for LTC2378IMS-16#PBF by Linear Technology

Results Overview of LTC2378IMS-16#PBF by Linear Technology

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

LTC2378IMS-16#PBF Information

LTC2378IMS-16#PBF by Linear Technology is an Analog to Digital Converter.
Analog to Digital Converters are under the broader part category of Converters.

A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.

Part Details for LTC2378IMS-16#PBF

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LTC2378IMS-16#PBF Part Data Attributes

LTC2378IMS-16#PBF Linear Technology
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LTC2378IMS-16#PBF Linear Technology LTC2378-16 - 16-Bit, 1Msps, Low Power SAR ADC with 97dB SNR; Package: MSOP; Pins: 16; Temperature Range: -40°C to 85°C
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer LINEAR TECHNOLOGY CORP
Part Package Code MSOP
Package Description LEAD FREE, PLASTIC, MSOP-16
Pin Count 16
Manufacturer Package Code MS
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Analog Input Voltage-Max 5.15 V
Analog Input Voltage-Min -0.05 V
Conversion Time-Max 0.525 µs
Converter Type ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code R-PDSO-G16
JESD-609 Code e3
Length 4.039 mm
Linearity Error-Max (EL) 0.0008%
Moisture Sensitivity Level 1
Number of Analog In Channels 1
Number of Bits 16
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Bit Code 2'S COMPLEMENT BINARY
Output Format SERIAL
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP16,.19,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Sample Rate 1 MHz
Seated Height-Max 1.1 mm
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm

LTC2378IMS-16#PBF Related Parts

LTC2378IMS-16#PBF Frequently Asked Questions (FAQ)

  • The recommended layout and placement for the LTC2378IMS-16#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input and output traces short and direct.

  • To ensure accurate conversion results with the LTC2378IMS-16#PBF, it's essential to follow proper PCB layout and design guidelines, use a high-quality clock source, and ensure that the input signal is properly filtered and conditioned. Additionally, it's recommended to use the device's internal clock or an external clock with a low jitter and to use the device's built-in calibration features.

  • The maximum sampling rate of the LTC2378IMS-16#PBF is 1.5Msps, and it can be achieved by using the device's internal clock or an external clock. The power consumption of the device increases with the sampling rate, but it can be reduced by using the device's power-down mode or by reducing the clock frequency.

  • The LTC2378IMS-16#PBF can be interfaced with a microcontroller or FPGA using a serial interface such as SPI or I2C. The recommended communication protocol is SPI, which allows for fast and efficient data transfer. The device's datasheet provides detailed information on the communication protocol and timing requirements.

  • The LTC2378IMS-16#PBF has a maximum operating temperature of 125°C, and it's essential to ensure that the device is properly heat-sinked and that the PCB is designed to dissipate heat efficiently. Additionally, it's recommended to use thermal simulation tools to estimate the device's junction temperature and to ensure that the device is operated within its recommended specifications.