Part Details for LTC2000IY-14#PBF by Analog Devices Inc
Overview of LTC2000IY-14#PBF by Analog Devices Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Price & Stock for LTC2000IY-14#PBF
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
505-LTC2000IY-14#PBF-ND
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DigiKey | IC DAC 14BIT A-OUT 170BGA Min Qty: 1 Lead time: 13 Weeks Container: Tray |
27 In Stock |
|
$90.4380 / $93.5200 | Buy Now |
|
DISTI #
584-LTC2000IY-14#PBF
|
Mouser Electronics | Digital to Analog Converters - DAC 16-/14-/11-B 2.5Gsps DACs RoHS: Compliant | 0 |
|
$90.4300 | Order Now |
|
DISTI #
LTC2000IY-14PBF
|
Richardson RFPD | CONVERTER - DAC RoHS: Compliant Min Qty: 170 | 0 |
|
$93.4100 / $102.5000 | Buy Now |
Part Details for LTC2000IY-14#PBF
LTC2000IY-14#PBF CAD Models
LTC2000IY-14#PBF Part Data Attributes
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LTC2000IY-14#PBF
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
LTC2000IY-14#PBF
Analog Devices Inc
16-/14-/11-Bit 2.5Gsps DACs
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Package Description | BGA-170 | |
| Pin Count | 170 | |
| Manufacturer Package Code | 05-08-1890 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.5.B.2.A | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Analog Devices | |
| Analog Output Voltage-Max | 1 V | |
| Analog Output Voltage-Min | -1 V | |
| Converter Type | D/A CONVERTER | |
| Input Bit Code | 2'S COMPLEMENT BINARY | |
| Input Format | SERIAL, PARALLEL, WORD | |
| JESD-30 Code | R-PBGA-B170 | |
| Length | 15 mm | |
| Linearity Error-Max (EL) | 0.012% | |
| Moisture Sensitivity Level | 3 | |
| Number of Bits | 14 | |
| Number of Functions | 1 | |
| Number of Terminals | 170 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA170,11X17,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.69 mm | |
| Settling Time-Nom (tstl) | 0.0022 µs | |
| Supply Current-Max | 790 mA | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 9 mm |