Part Details for LTC2000CY-11#PBF by Linear Technology
Results Overview of LTC2000CY-11#PBF by Linear Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LTC2000CY-11#PBF Information
LTC2000CY-11#PBF by Linear Technology is a Digital to Analog Converter.
Digital to Analog Converters are under the broader part category of Converters.
A converter is an electrical circuit that transforms electric energy into a different form that will support a elecrical load needed by a device. Read more about Converters on our Converters part category page.
Part Details for LTC2000CY-11#PBF
LTC2000CY-11#PBF CAD Models
LTC2000CY-11#PBF Part Data Attributes
|
LTC2000CY-11#PBF
Linear Technology
Buy Now
Datasheet
|
Compare Parts:
LTC2000CY-11#PBF
Linear Technology
LTC2000 - 16-/14-/11-Bit 2.5Gsps DACs; Package: BGA; Pins: 170; Temperature Range: 0°C to 70°C
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
Part Package Code | BGA | |
Package Description | BGA-170 | |
Pin Count | 170 | |
Manufacturer Package Code | BGA | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Analog Output Voltage-Max | 1 V | |
Analog Output Voltage-Min | -1 V | |
Converter Type | D/A CONVERTER | |
Input Bit Code | 2'S COMPLEMENT BINARY | |
Input Format | SERIAL, PARALLEL, WORD | |
JESD-30 Code | R-PBGA-B170 | |
Length | 15 mm | |
Linearity Error-Max (EL) | 0.049% | |
Number of Bits | 11 | |
Number of Functions | 1 | |
Number of Terminals | 170 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA170,11X17,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.69 mm | |
Settling Time-Nom (tstl) | 0.0022 µs | |
Supply Current-Max | 790 mA | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 9 mm |
LTC2000CY-11#PBF Frequently Asked Questions (FAQ)
-
The maximum operating temperature range for the LTC2000CY-11#PBF is -40°C to 125°C.
-
To ensure stability, follow the recommended layout and component selection guidelines in the datasheet, and make sure to decouple the input and output pins with suitable capacitors.
-
Yes, the LTC2000CY-11#PBF is available in a variety of grades, including the 'MP' grade which is suitable for high-reliability and aerospace applications. However, it's essential to consult with Linear Technology's application engineers to ensure the device meets the specific requirements of your application.
-
To calculate the power dissipation, use the formula: Pd = (Vin - Vout) x Iout + (Vin x Iq), where Vin is the input voltage, Vout is the output voltage, Iout is the output current, and Iq is the quiescent current. Make sure to consider the thermal resistance of the package and the PCB layout when calculating the junction temperature.
-
Yes, the LTC2000CY-11#PBF is compatible with lead-free soldering processes, but it's essential to follow the recommended soldering profile and temperature guidelines to ensure reliable assembly.