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Overview of LS7561 by LSI Computer Systems Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for LS7561 by LSI Computer Systems Inc
Part Data Attributes for LS7561 by LSI Computer Systems Inc
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Contact Manufacturer
|
Ihs Manufacturer
|
LSI COMPUTER SYSTEMS INC
|
Package Description
|
DIP, DIP28,.3
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.39.00.01
|
JESD-30 Code
|
R-PDIP-T28
|
JESD-609 Code
|
e0
|
Number of Terminals
|
28
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-25 °C
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Qualification Status
|
Not Qualified
|
Supply Current-Max (Isup)
|
11 mA
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|