Part Details for LPC812M101JD20 by NXP Semiconductors
Overview of LPC812M101JD20 by NXP Semiconductors
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Part Details for LPC812M101JD20
LPC812M101JD20 CAD Models
LPC812M101JD20 Part Data Attributes
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LPC812M101JD20
NXP Semiconductors
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Datasheet
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LPC812M101JD20
NXP Semiconductors
IC RISC MICROCONTROLLER, Microcontroller
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | SOP-20 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | NO | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | R-PDSO-G20 | |
| Length | 12.8 mm | |
| Low Power Mode | YES | |
| Number of External Interrupts | 8 | |
| Number of I/O Lines | 18 | |
| Number of Terminals | 20 | |
| Number of Timers | 7 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP20,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| RAM (bytes) | 4096 | |
| ROM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 2.65 mm | |
| Speed | 30 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 7.5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |