Datasheets
LPC4078FET180,551 by: NXP Semiconductors

LPC407x - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI BGA 180-Pin

Part Details for LPC4078FET180,551 by NXP Semiconductors

Overview of LPC4078FET180,551 by NXP Semiconductors

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Price & Stock for LPC4078FET180,551

Part # Distributor Description Stock Price Buy
DISTI # 45W8430
Newark Lpc4078Fet180/ Tray Rohs Compliant: Yes |Nxp LPC4078FET180,551 RoHS: Compliant Min Qty: 189 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 100 $9.8200
  • 250 $8.5400
  • 500 $8.3000
$8.3000 / $9.8200 Buy Now
DISTI # 568-14353-ND
DigiKey IC MCU 32BIT 512KB FLSH 180TFBGA Lead time: 13 Weeks Container: Tray Limited Supply - Call
Buy Now
DISTI # LPC4078FET180,551
Avnet Americas MCU 32-bit LPC407x ARM Cortex M4 RISC 512KB Flash 3.3V 180-Pin TFBGA Tray - Trays (Alt: LPC4078FET180,551) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 13 Weeks, 0 Days Container: Tray 0
  • 189 $6.8137
$6.8137 Buy Now
Future Electronics ARM Microcontrollers - MCU LPC4078FET180 RoHS: Compliant pbFree: Yes Min Qty: 189 Package Multiple: 189 Lead time: 13 Weeks Container: Tray 0
Tray
  • 189 $7.7400
  • 378 $7.7100
  • 567 $7.6700
$7.6700 / $7.7400 Buy Now

Part Details for LPC4078FET180,551

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LPC4078FET180,551 Part Data Attributes

LPC4078FET180,551 NXP Semiconductors
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LPC4078FET180,551 NXP Semiconductors LPC407x - 32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM; USB Device/Host/OTG; Ethernet; EMC; SPIFI BGA 180-Pin
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Pin Count 180
Manufacturer Package Code SOT570-3
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family CORTEX-M4
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
JESD-30 Code S-PBGA-B180
JESD-609 Code e1
Length 12 mm
Moisture Sensitivity Level 3
Number of I/O Lines 142
Number of Terminals 180
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA180,14X14,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 98304
ROM (words) 524288
ROM Programmability FLASH
Speed 120 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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