Part Details for LPC3141FET180,551 by NXP Semiconductors
Overview of LPC3141FET180,551 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
Price & Stock for LPC3141FET180,551
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
85AK8439
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Newark | Arm926Ej-S With 192 Kb Sram, Usb High-Speed Otg, Sd/Mmc, Nand Flash Controller/ Tray Rohs Compliant: Yes |Nxp LPC3141FET180,551 RoHS: Compliant Min Qty: 189 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$10.4100 / $12.3200 | Buy Now |
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DISTI #
LPC3141FET180,551
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Avnet Americas | - Trays (Alt: LPC3141FET180,551) RoHS: Compliant Min Qty: 33 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 387 Partner Stock |
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$9.6390 / $11.4750 | Buy Now |
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DISTI #
LPC3141FET180,551
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Avnet Americas | MCU 32-bit LPC3100 ARM926EJ-S RISC ROMLess 1.2V 180-Pin TFBGA Tray - Trays (Alt: LPC3141FET180,551) RoHS: Compliant Min Qty: 66 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 328 Partner Stock |
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RFQ | |
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DISTI #
LPC3141FET180,551
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Avnet Americas | MCU 32-bit LPC3100 ARM926EJ-S RISC ROMLess 1.2V 180-Pin TFBGA Tray - Trays (Alt: LPC3141FET180,551) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Container: Tray | 0 |
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$8.4158 | Buy Now |
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Rochester Electronics | LPC3141 - Arm9, 32-Bit RISC Microcontroller RoHS: Compliant Status: Obsolete Min Qty: 1 | 387 |
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$9.4800 / $11.1600 | Buy Now |
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Flip Electronics | Stock, ship today | 14498 |
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RFQ |
Part Details for LPC3141FET180,551
LPC3141FET180,551 CAD Models
LPC3141FET180,551 Part Data Attributes
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LPC3141FET180,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC3141FET180,551
NXP Semiconductors
LPC3141FET180 - ARM926EJ-S with 192 kB SRAM, USB High-speed OTG, SD/MMC, NAND flash controller BGA 180-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM HEIGHT, 0.80 MM PITCH, PLASTIC, SOT570-3, TFBGA-180 | |
| Pin Count | 180 | |
| Manufacturer Package Code | SOT570-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | ARM9 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B180 | |
| JESD-609 Code | e1 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 21 | |
| Number of Terminals | 180 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA180,14X14,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 196608 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 270 MHz | |
| Supply Voltage-Max | 1.3 V | |
| Supply Voltage-Min | 1.1 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |