Part Details for LPC2458FET180,529 by NXP Semiconductors
Overview of LPC2458FET180,529 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
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Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
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Computing and Data Storage
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Part Details for LPC2458FET180,529
LPC2458FET180,529 CAD Models
LPC2458FET180,529 Part Data Attributes:
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LPC2458FET180,529
NXP Semiconductors
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LPC2458FET180,529
NXP Semiconductors
LPC2458 - Single-chip 16-bit/32-bit micro; 512 kB flash, Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface BGA 180-Pin
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 12 X 12 MM, 0.80 MM HEIGHT, SOT570-2, TFBGA-180 | |
| Pin Count | 180 | |
| Manufacturer Package Code | SOT570-3 | |
| Reach Compliance Code | unknown | |
| Has ADC | YES | |
| Address Bus Width | 20 | |
| Bit Size | 32 | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B180 | |
| Length | 12 mm | |
| Number of I/O Lines | 136 | |
| Number of Terminals | 180 | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |