Part Details for LPC2420FET208,551 by NXP Semiconductors
Overview of LPC2420FET208,551 by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for LPC2420FET208,551
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
99R2728
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Newark | Flashless 16-Bit/32-Bit Microcontroller, Ethernet, Can, Isp/Iap, Usb 2.0 Device/Host/Otg, External Memory Interface/ Tray Rohs Compliant: Yes |Nxp LPC2420FET208,551 Min Qty: 126 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$9.4000 / $11.1300 | Buy Now |
|
DISTI #
568-5216-ND
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DigiKey | IC MCU 16/32BIT ROMLESS 208TFBGA Min Qty: 1 Lead time: 13 Weeks Container: Tray |
126 In Stock |
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$11.3094 / $16.8600 | Buy Now |
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DISTI #
LPC2420FET208,551
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Avnet Americas | MCU 16-bit/32-bit LPC2000 ARM7TDMI-S RISC ROMLess 3.3V 208-Pin TFBGA Tray - Trays (Alt: LPC2420FET208,551) RoHS: Compliant Min Qty: 126 Package Multiple: 126 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$8.5709 / $9.8842 | Buy Now |
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DISTI #
771-LPC2420FET208551
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Mouser Electronics | ARM Microcontrollers - MCU 16b ROMLess 160I/O RoHS: Compliant | 126 |
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$11.0000 / $16.8600 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 126 Package Multiple: 126 Container: Tray | 0Tray |
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$8.6400 | Buy Now |
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|
Flip Electronics | Stock | 76 |
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RFQ |
Part Details for LPC2420FET208,551
LPC2420FET208,551 CAD Models
LPC2420FET208,551 Part Data Attributes:
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LPC2420FET208,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC2420FET208,551
NXP Semiconductors
LPC2420/2460 - Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface BGA 208-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | FBGA, BGA208,17X17,32 | |
| Pin Count | 208 | |
| Manufacturer Package Code | SOT950-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | ARM7 | |
| Clock Frequency-Max | 25 MHz | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B208 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of I/O Lines | 160 | |
| Number of Terminals | 208 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA208,17X17,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 100352 | |
| Speed | 72 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |