Datasheets
LPC2364HBD100 by:
NXP Semiconductors
Honest Han
NXP Semiconductors
Not Found

IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100, Microcontroller

Part Details for LPC2364HBD100 by NXP Semiconductors

Results Overview of LPC2364HBD100 by NXP Semiconductors

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LPC2364HBD100 Information

LPC2364HBD100 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for LPC2364HBD100

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LPC2364HBD100 Part Data Attributes

LPC2364HBD100 NXP Semiconductors
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LPC2364HBD100 NXP Semiconductors IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100, Microcontroller
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFP
Package Description 14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100
Pin Count 100
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family ARM7
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width 16
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Moisture Sensitivity Level 3
Number of I/O Lines 70
Number of Terminals 100
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 34816
ROM (words) 131072
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 72 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Alternate Parts for LPC2364HBD100

This table gives cross-reference parts and alternative options found for LPC2364HBD100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC2364HBD100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
LPC2364FBD100,551 NXP Semiconductors Check for Price LPC2364FBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin LPC2364HBD100 vs LPC2364FBD100,551
LPC2364HBD100,551 NXP Semiconductors $12.2453 LPC2364HBD100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC QFP 100-Pin LPC2364HBD100 vs LPC2364HBD100,551
LPC2364FET100 NXP Semiconductors Check for Price IC 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100, Microcontroller LPC2364HBD100 vs LPC2364FET100
LPC2364FET100,518 NXP Semiconductors $13.0126 LPC2364FET100 - ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC BGA 100-Pin LPC2364HBD100 vs LPC2364FET100,518

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