There are no models available for this part yet.
Overview of LPC2157FBD100 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 1 replacement )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 1 option )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Environmental Monitoring
Space Technology
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Transportation and Logistics
Energy and Power Systems
Electronic Manufacturing
Renewable Energy
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Robotics and Drones
Price & Stock for LPC2157FBD100 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Bristol Electronics | 90 |
|
RFQ |
CAD Models for LPC2157FBD100 by NXP Semiconductors
Part Data Attributes for LPC2157FBD100 by NXP Semiconductors
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
QFP
|
|
Package Description
|
14 X 14 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT407-1, LQFP-100
|
|
Pin Count
|
100
|
|
Reach Compliance Code
|
unknown
|
|
HTS Code
|
8542.31.00.01
|
|
Has ADC
|
YES
|
|
Address Bus Width
|
|
|
Bit Size
|
32
|
|
CPU Family
|
ARM7
|
|
Clock Frequency-Max
|
25 MHz
|
|
DAC Channels
|
YES
|
|
DMA Channels
|
NO
|
|
External Data Bus Width
|
|
|
JESD-30 Code
|
S-PQFP-G100
|
|
JESD-609 Code
|
e2
|
|
Length
|
14 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of I/O Lines
|
38
|
|
Number of Terminals
|
100
|
|
On Chip Program ROM Width
|
8
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
PWM Channels
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFQFP
|
|
Package Equivalence Code
|
QFP100,.63SQ,20
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
FLATPACK, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
RAM (bytes)
|
32768
|
|
ROM (words)
|
524288
|
|
ROM Programmability
|
FLASH
|
|
Seated Height-Max
|
1.6 mm
|
|
Speed
|
60 MHz
|
|
Supply Current-Max
|
100 mA
|
|
Supply Voltage-Max
|
3.6 V
|
|
Supply Voltage-Min
|
3.3 V
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver (Sn/Ag)
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.5 mm
|
|
Terminal Position
|
QUAD
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
14 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
|
Alternate Parts for LPC2157FBD100
This table gives cross-reference parts and alternative options found for LPC2157FBD100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC2157FBD100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| LPC2157FBD100,551 | LPC2157/2158 - Single-chip 16-bit/32-bit microcontrollers; 512 kB flash, with 32 segment x 4 LCD driver QFP 100-Pin | NXP Semiconductors | LPC2157FBD100 vs LPC2157FBD100,551 |