Part Details for LPC1853FBD208,551 by NXP Semiconductors
Overview of LPC1853FBD208,551 by NXP Semiconductors
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Part Details for LPC1853FBD208,551
LPC1853FBD208,551 CAD Models
LPC1853FBD208,551 Part Data Attributes:
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LPC1853FBD208,551
NXP Semiconductors
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Datasheet
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LPC1853FBD208,551
NXP Semiconductors
Cortex-M3, 512 kB dual-bank flash, 136 kB SRAM, 2 HS USB with on-chip PHY, Ethernet, LCD, CAN, AES, SPIFI, SCT, SOT459-1 Package, Standard Marking, Tray Dry Pack, Bakeable, Single
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Pin Count | 208 | |
| Manufacturer Package Code | SOT459-1 | |
| Reach Compliance Code | compliant | |
| Has ADC | YES | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | CORTEX-M3 | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| JESD-30 Code | S-PQFP-G208 | |
| Number of Terminals | 208 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 139264 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Speed | 180 MHz | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |