Part Details for LPC1820FBD100,551 by NXP Semiconductors
Overview of LPC1820FBD100,551 by NXP Semiconductors
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- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for LPC1820FBD100,551
LPC1820FBD100,551 CAD Models
LPC1820FBD100,551 Part Data Attributes:
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LPC1820FBD100,551
NXP Semiconductors
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Datasheet
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LPC1820FBD100,551
NXP Semiconductors
Cortex-M3, 168 kB SRAM, HS USB with on-chip PHY, CAN, AES, SPIFI, SCT, SOT407-1 Package, Standard Marking, Tray Dry Pack, Bakeable, Single
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Pin Count | 100 | |
| Manufacturer Package Code | SOT407-1 | |
| Reach Compliance Code | compliant | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| JESD-30 Code | S-PQFP-G100 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 172032 | |
| ROM (words) | 65536 | |
| ROM Programmability | UVPROM | |
| Speed | 150 MHz | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD |