Part Details for LPC1774FBD144 by NXP Semiconductors
Overview of LPC1774FBD144 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC1774FBD144
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | 32-bit ARM Cortex-M3 microcontroller, up to 512 kB flash and 96 kB SRAM, USB Device/Host/OTG | 7600 |
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RFQ |
Part Details for LPC1774FBD144
LPC1774FBD144 CAD Models
LPC1774FBD144 Part Data Attributes:
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LPC1774FBD144
NXP Semiconductors
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Datasheet
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LPC1774FBD144
NXP Semiconductors
IC 32-BIT, FLASH, 120 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144, Microcontroller
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 20 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 8 | |
| JESD-30 Code | S-PQFP-G144 | |
| JESD-609 Code | e3 | |
| Length | 20 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of I/O Lines | 119 | |
| Number of Terminals | 144 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 40960 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 120 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |