Part Details for LPC1768FET100Z by NXP Semiconductors
Overview of LPC1768FET100Z by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for LPC1768FET100Z
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1768FET100Z
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Avnet Americas | MCU 32-Bit LPC1768 ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 100-Pin TFBGA T/R - Tape and Reel (Alt: LPC1768FET100Z) RoHS: Not Compliant Min Qty: 260 Package Multiple: 260 Container: Reel | 0 |
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RFQ | |
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DISTI #
LPC1768FET100Z
|
Avnet Americas | MCU 32-Bit LPC1768 ARM Cortex M3 RISC 512KB Flash 2.5V/3.3V 100-Pin TFBGA T/R - Tape and Reel (Alt: LPC1768FET100Z) RoHS: Not Compliant Min Qty: 260 Package Multiple: 260 Container: Reel | 0 |
|
RFQ |
Part Details for LPC1768FET100Z
LPC1768FET100Z CAD Models
LPC1768FET100Z Part Data Attributes:
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LPC1768FET100Z
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1768FET100Z
NXP Semiconductors
RISC MICROCONTROLLER
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PBGA-B100 | |
| Length | 9 mm | |
| Low Power Mode | YES | |
| Number of DMA Channels | 8 | |
| Number of External Interrupts | 4 | |
| Number of I/O Lines | 70 | |
| Number of Terminals | 100 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA100,10X10,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| RAM (bytes) | 65536 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 100 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |