Datasheets
LPC1768FET100 by:

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-926-1, TFBGA-100

Part Details for LPC1768FET100 by NXP Semiconductors

Overview of LPC1768FET100 by NXP Semiconductors

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

Price & Stock for LPC1768FET100

Part # Distributor Description Stock Price Buy
Quest Components RISC MICROCONTROLLER, 32-BIT, FLASH, 100MHZ, CMOS, PBGA100 17
  • 1 $47.3538
  • 6 $44.9861
  • 12 $42.6184
$42.6184 / $47.3538 Buy Now
Chip 1 Exchange INSTOCK 800
RFQ
LCSC TFBGA-100 Microcontroller Units (MCUs/MPUs/SOCs) ROHS 468
  • 1 $11.9003
  • 10 $11.4349
  • 30 $10.6294
  • 100 $9.0244
$9.0244 / $11.9003 Buy Now
Win Source Electronics IC MCU 32BIT 512KB FLASH 100BGA 22503
  • 4 $12.7180
  • 4 $12.7180
  • 10 $10.4350
  • 10 $10.4350
  • 15 $10.1090
  • 15 $10.1090
$10.1090 / $12.7180 Buy Now

Part Details for LPC1768FET100

LPC1768FET100 CAD Models

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LPC1768FET100 Part Data Attributes:

LPC1768FET100 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
LPC1768FET100 NXP Semiconductors 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-926-1, TFBGA-100
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code BGA
Package Description TFBGA,
Pin Count 100
Manufacturer Package Code SOT-926-1
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
JESD-30 Code S-PBGA-B100
Length 9 mm
Moisture Sensitivity Level 3
Number of I/O Lines 70
Number of Terminals 100
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
ROM Programmability FLASH
Seated Height-Max 1.2 mm
Speed 100 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2.4 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 9 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

Alternate Parts for LPC1768FET100

This table gives cross-reference parts and alternative options found for LPC1768FET100. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC1768FET100, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
LPC1768FET100,551 LPC1768FET100 - 512kB flash, 64kB SRAM, Ethernet, USB, TFBGA100 package BGA 100-Pin NXP Semiconductors LPC1768FET100 vs LPC1768FET100,551
Part Number Description Manufacturer Compare
LPC1768FET100,551 LPC1768FET100 - 512kB flash, 64kB SRAM, Ethernet, USB, TFBGA100 package BGA 100-Pin NXP Semiconductors LPC1768FET100 vs LPC1768FET100,551

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