Datasheets
LPC1345FHN33 by: NXP Semiconductors

RISC MICROCONTROLLER

Part Details for LPC1345FHN33 by NXP Semiconductors

Results Overview of LPC1345FHN33 by NXP Semiconductors

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

LPC1345FHN33 Information

LPC1345FHN33 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Part Details for LPC1345FHN33

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LPC1345FHN33 Part Data Attributes

LPC1345FHN33 NXP Semiconductors
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LPC1345FHN33 NXP Semiconductors RISC MICROCONTROLLER
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description VQFN-33
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PQCC-N33
Length 7 mm
Moisture Sensitivity Level 3
Number of I/O Lines 28
Number of Terminals 33
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
ROM Programmability FLASH
Seated Height-Max 1 mm
Speed 72 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 2 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC