Part Details for LPC1317FHN33,551 by NXP Semiconductors
Overview of LPC1317FHN33,551 by NXP Semiconductors
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Education and Research
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Computing and Data Storage
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Electronic Manufacturing
Communication and Networking
Robotics and Drones
Price & Stock for LPC1317FHN33,551
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
90T5853
|
Newark | Entry-Level 32-Bit Microcontroller (Mcu) Based On Arm Cortex-M3 Core/ Tray Rohs Compliant: Yes |Nxp LPC1317FHN33,551 RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$3.6200 / $3.7300 | Buy Now |
|
DISTI #
568-9599-ND
|
DigiKey | IC MCU 32BIT 64KB FLASH 32HVQFN Min Qty: 1 Lead time: 13 Weeks Container: Tray |
247 In Stock |
|
$3.6595 / $6.4500 | Buy Now |
|
DISTI #
LPC1317FHN33,551
|
Avnet Americas | MCU 32-bit LPC1300 ARM Cortex M3 RISC 64KB Flash 2.5V/3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1317FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
771-LPC1317FHN33,551
|
Mouser Electronics | ARM Microcontrollers - MCU 32bit ARM Cortex-M3 64KB Flash 10KB SRAM RoHS: Compliant | 258 |
|
$3.3900 / $6.7300 | Buy Now |
|
|
Future Electronics | LPC13xx Series 64 kB Flash 10 kB RAM SMT 32-Bit-Microcontroller - HVQFN-33 RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks Container: Tray | 35720Tray |
|
$3.3000 / $3.8200 | Buy Now |
|
DISTI #
82783564
|
Verical | MCU 32-bit ARM Cortex M3 RISC 64KB Flash 2.5V/3.3V 33-Pin HVQFN EP Tray RoHS: Compliant Min Qty: 5 Package Multiple: 1 Date Code: 2349 | Americas - 5980 |
|
$3.7750 / $7.7375 | Buy Now |
|
DISTI #
LPC1317FHN33,551
|
Avnet Silica | MCU 32-bit LPC1300 ARM Cortex M3 RISC 64KB Flash 2.5V/3.3V 33-Pin HVQFN EP Tray (Alt: LPC1317FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
DISTI #
C1S537100811350
|
Chip1Stop | Entry-level 32-bit Microcontroller (MCU) based on ARM Cortex-M3 Core RoHS: Compliant pbFree: Yes Container: Tray | 5980 |
|
$3.1800 / $8.0100 | Buy Now |
|
DISTI #
LPC1317FHN33,551
|
EBV Elektronik | MCU 32-bit LPC1300 ARM Cortex M3 RISC 64KB Flash 2.5V/3.3V 33-Pin HVQFN EP Tray (Alt: LPC1317FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for LPC1317FHN33,551
LPC1317FHN33,551 CAD Models
LPC1317FHN33,551 Part Data Attributes
|
|
LPC1317FHN33,551
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC1317FHN33,551
NXP Semiconductors
LPC1317FHN33 - 64kB Flash, 10kB SRAM QFN 32-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33 | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT865-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N33 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 26 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 8192 | |
| ROM (words) | 65536 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 72 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |