Datasheets
LPC1114FHN33/203,551 by: NXP Semiconductors

RISC Microcontroller

Part Details for LPC1114FHN33/203,551 by NXP Semiconductors

Results Overview of LPC1114FHN33/203,551 by NXP Semiconductors

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

LPC1114FHN33/203,551 Information

LPC1114FHN33/203,551 by NXP Semiconductors is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for LPC1114FHN33/203,551

Part # Distributor Description Stock Price Buy
DISTI # LPC1114FHN33/203,5
Avnet Americas MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1114FHN3... 3/203,5) more RoHS: Not Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray 0
  • 520 $1.6807
  • 1,040 $1.6668
  • 1,560 $1.6529
  • 2,600 $1.6390
  • 5,200 $1.6251
$1.6251 / $1.6807 Buy Now
DISTI # LPC1114FHN33/203,5
Avnet Silica MCU 32bit LPC1100 ARM Cortex M0 RISC 32KB Flash 33V 32Pin HVQFN EP Tray (Alt: LPC1114FHN33/203,5) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days Silica - 0
Buy Now

Part Details for LPC1114FHN33/203,551

LPC1114FHN33/203,551 CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

LPC1114FHN33/203,551 Part Data Attributes

LPC1114FHN33/203,551 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
LPC1114FHN33/203,551 NXP Semiconductors RISC Microcontroller
Select a part to compare:
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description ,
Reach Compliance Code unknown
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan NO
CPU Family CORTEX-M0
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQCC-N33
Length 7 mm
Low Power Mode YES
Number of I/O Lines 28
Number of Serial I/Os 1
Number of Terminals 33
Number of Timers 5
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC32,.27SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (bytes) 4096
ROM (words) 32768
ROM Programmability FLASH
Seated Height-Max 1 mm
Speed 50 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

LPC1114FHN33/203,551 Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the LPC1114FHN33 is -40°C to +85°C.

  • The clock source for the LPC1114FHN33 can be configured using the SYSCON registers. The internal RC oscillator can be used as the clock source, or an external clock source can be used by connecting a crystal oscillator to the CLKIN pin.

  • The maximum current consumption of the LPC1114FHN33 is approximately 13.5 mA at 3.3V and 48 MHz.

  • The LPC1114FHN33 can be programmed using a variety of tools, including the NXP LPCXpresso IDE, Keil µVision, and IAR Embedded Workbench. The device can be programmed using the UART, SPI, or I2C interfaces.

  • The BOOT pin on the LPC1114FHN33 is used to select the boot mode of the device. When the BOOT pin is pulled high, the device boots from the internal flash memory. When the BOOT pin is pulled low, the device boots from an external source, such as a serial interface.