Part Details for LPC1112FHN33/102,5 by NXP Semiconductors
Overview of LPC1112FHN33/102,5 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for LPC1112FHN33/102,5
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
24T8411
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Newark | Microcontroller Mcu, 32 Bit, Cortex-M0, 50Mhz, Hvqfn-33, Product Range:Lpc Family Lpc1100 Series Microcontrollers, Device Core:Arm Cortex-M0, Data Bus Width:32 Bit, Operating Frequency Max:50Mhz, Program Memory Size:16Kb Rohs Compliant: Yes |Nxp LPC1112FHN33/102,5 RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$1.8100 | Buy Now |
|
DISTI #
568-5144-ND
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DigiKey | IC MCU 32BIT 16KB FLASH 32HVQFN Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now |
Part Details for LPC1112FHN33/102,5
LPC1112FHN33/102,5 CAD Models
LPC1112FHN33/102,5 Part Data Attributes
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LPC1112FHN33/102,5
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1112FHN33/102,5
NXP Semiconductors
LPC1112FHN33 - 16kB flash, 4kB SRAM, HVQFN32 package QFN 32-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | HVQFN-33 | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT865-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N33 | |
| JESD-609 Code | e4 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 28 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 2048 | |
| ROM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |