Part Details for LPC1112FHN33/101,551 by NXP Semiconductors
Overview of LPC1112FHN33/101,551 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for LPC1112FHN33/101,551
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1112FHN33/101,5
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Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 16KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1112FHN33/101,5) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 260 |
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$1.4466 / $1.4948 | Buy Now |
|
DISTI #
LPC1112FHN33/101,5
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Avnet Silica | MCU 32-Bit LPC1112 ARM Cortex-M0 RISC 16KB Flash 1.8V to 3.6V 32-Pin HVQFN Tray (Alt: LPC1112FHN33/101,5) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for LPC1112FHN33/101,551
LPC1112FHN33/101,551 CAD Models
LPC1112FHN33/101,551 Part Data Attributes
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LPC1112FHN33/101,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1112FHN33/101,551
NXP Semiconductors
RISC Microcontroller
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PQCC-N33 | |
| Length | 7 mm | |
| Low Power Mode | YES | |
| Number of I/O Lines | 28 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 33 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| RAM (bytes) | 2048 | |
| ROM (words) | 16384 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 50 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |