Part Details for LPC1111FHN33/101 by NXP Semiconductors
Overview of LPC1111FHN33/101 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for LPC1111FHN33/101
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1111FHN33/101
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TME | IC: ARM microcontroller, 2kBSRAM,8kBFLASH, QFN32, 1.8÷3.6VDC Min Qty: 1 | 0 |
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$1.5600 / $2.1800 | RFQ |
Part Details for LPC1111FHN33/101
LPC1111FHN33/101 CAD Models
LPC1111FHN33/101 Part Data Attributes:
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LPC1111FHN33/101
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1111FHN33/101
NXP Semiconductors
IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQCCN, | |
Pin Count | 33 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQCC-N33 | |
JESD-609 Code | e4 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 28 | |
Number of Terminals | 33 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
ROM Programmability | FLASH | |
Seated Height-Max | 1 mm | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Alternate Parts for LPC1111FHN33/101
This table gives cross-reference parts and alternative options found for LPC1111FHN33/101. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LPC1111FHN33/101, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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LPC1114FHN33/301,5 | LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | NXP Semiconductors | LPC1111FHN33/101 vs LPC1114FHN33/301,5 |
LPC1111FHN33/201 | IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller | NXP Semiconductors | LPC1111FHN33/101 vs LPC1111FHN33/201 |
LPC1112FHN33/201 | IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQCC33, 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, HVQFN-33, Microcontroller | NXP Semiconductors | LPC1111FHN33/101 vs LPC1112FHN33/201 |
LPC1114FHN33/301:5 | LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | NXP Semiconductors | LPC1111FHN33/101 vs LPC1114FHN33/301:5 |
LPC1114FHN33/201,5 | LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin | NXP Semiconductors | LPC1111FHN33/101 vs LPC1114FHN33/201,5 |