Datasheets
LPC1111FHN33,551 by: NXP Semiconductors

LPC1111FHN33

Part Details for LPC1111FHN33,551 by NXP Semiconductors

Overview of LPC1111FHN33,551 by NXP Semiconductors

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Part Details for LPC1111FHN33,551

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LPC1111FHN33,551 Part Data Attributes:

LPC1111FHN33,551 NXP Semiconductors
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LPC1111FHN33,551 NXP Semiconductors LPC1111FHN33
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HVQFN-32
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan NO
CPU Family CORTEX-M0
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQCC-N32
Length 7 mm
Low Power Mode YES
Number of External Interrupts
Number of I/O Lines 28
Number of Serial I/Os 1
Number of Terminals 32
Number of Timers 5
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC32,.27SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (bytes) 2048
ROM (words) 8192
ROM Programmability FLASH
Seated Height-Max 1 mm
Speed 50 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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