Part Details for LP5553TLX by Texas Instruments
Overview of LP5553TLX by Texas Instruments
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for LP5553TLX
LP5553TLX CAD Models
LP5553TLX Part Data Attributes
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LP5553TLX
Texas Instruments
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Datasheet
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LP5553TLX
Texas Instruments
IC,MULTIPLE REGULATOR CIRCUIT,BGA,36PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | FBGA, BGA36,6X6,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B36 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 36 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA36,6X6,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Supply Current-Max (Isup) | 0.93 mA | |
Supply Voltage-Nom (Vsup) | 3.6 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 |