Part Details for LP3991TL-1.3/NOPB by National Semiconductor Corporation
Overview of LP3991TL-1.3/NOPB by National Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar | |
LP3991TL-1.7/NOPB | Texas Instruments | 300-mA LDO for Digital Applications 4-DSBGA |
Price & Stock for LP3991TL-1.3/NOPB
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
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Rochester Electronics | LP3991 300-mA LDO for Digital Applications RoHS: Compliant Status: Active Min Qty: 1 | 3586 |
|
$0.3117 / $0.3667 | Buy Now |
Part Details for LP3991TL-1.3/NOPB
LP3991TL-1.3/NOPB CAD Models
LP3991TL-1.3/NOPB Part Data Attributes
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LP3991TL-1.3/NOPB
National Semiconductor Corporation
Buy Now
Datasheet
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LP3991TL-1.3/NOPB
National Semiconductor Corporation
Regulator, 1 Output, CMOS, PBGA4
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
Adjustability | FIXED | |
Input Voltage Absolute-Max | 6.5 V | |
JESD-30 Code | S-PBGA-B4 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 1 | |
Number of Outputs | 1 | |
Number of Terminals | 4 | |
Operating Temperature TJ-Max | 125 °C | |
Operating Temperature TJ-Min | -40 °C | |
Output Current1-Max | 0.3 A | |
Output Voltage1-Nom | 1.3 V | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA4,2X2,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Voltage Tolerance-Max | 3% |