Part Details for LMX5452SM/NOPB by Texas Instruments
Overview of LMX5452SM/NOPB by Texas Instruments
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Applications
Telecommunications
Part Details for LMX5452SM/NOPB
LMX5452SM/NOPB CAD Models
LMX5452SM/NOPB Part Data Attributes:
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LMX5452SM/NOPB
Texas Instruments
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LMX5452SM/NOPB
Texas Instruments
Micro-Module Integrated Bluetooth 1.2 Baseband Controller and Radio 60-NFBGA -40 to 85
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LFBGA, BGA60,6X10,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PBGA-B60 | |
| JESD-609 Code | e1 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 60 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA60,6X10,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.3 mm | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6 mm |