Part Details for LMV831MG/NOPB by National Semiconductor Corporation
Overview of LMV831MG/NOPB by National Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Environmental Monitoring
Industrial Automation
Agriculture Technology
Medical Imaging
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
| LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar |
Price & Stock for LMV831MG/NOPB
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | LMV831 Single 3.3 MHz Low Power CMOS, EMI Hardened Operational Amplifier RoHS: Compliant Status: Active Min Qty: 1 | 78 |
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RFQ |
Part Details for LMV831MG/NOPB
LMV831MG/NOPB CAD Models
LMV831MG/NOPB Part Data Attributes
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LMV831MG/NOPB
National Semiconductor Corporation
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Datasheet
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LMV831MG/NOPB
National Semiconductor Corporation
Operational Amplifier, 1 Func, 1230uV Offset-Max, CMOS, PDSO5
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Reach Compliance Code | compliant | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Bias Current-Max (IIB) @25C | 0.00001 µA | |
| Common-mode Reject Ratio-Min | 75 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 1230 µV | |
| JESD-30 Code | R-PDSO-G5 | |
| JESD-609 Code | e3 | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP5/6,.08 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Packing Method | TAPE AND REEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.3 mA | |
| Supply Voltage Limit-Max | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Voltage Gain-Min | 125000 | |
| Wideband | NO |