Part Details for LMV226TL by National Semiconductor Corporation
Overview of LMV226TL by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LMV226TLX/NOPB | Texas Instruments | RF Power Detectors for CDMA and WCDMA in micro SMD 4-DSBGA -40 to 85 | |
LMV226TL/NOPB | Texas Instruments | RF Power Detectors for CDMA and WCDMA in micro SMD 4-DSBGA -40 to 85 |
Part Details for LMV226TL
LMV226TL CAD Models
LMV226TL Part Data Attributes
|
LMV226TL
National Semiconductor Corporation
Buy Now
Datasheet
|
Compare Parts:
LMV226TL
National Semiconductor Corporation
IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4, Cellular Telephone Circuit
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B4 | |
JESD-609 Code | e1 | |
Length | 1.014 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.675 mm | |
Supply Voltage-Nom | 2.7 V | |
Surface Mount | YES | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 1.014 mm |