Part Details for LMP7709MT/NOPB by National Semiconductor Corporation
Overview of LMP7709MT/NOPB by National Semiconductor Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar |
Price & Stock for LMP7709MT/NOPB
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
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Rochester Electronics | LMP7709 Precision, CMOS Input, RRIO, Wide Supply Range Decompensated Quad Amplifier RoHS: Compliant Status: Active Min Qty: 1 | 511 |
|
$2.8600 / $3.3700 | Buy Now |
Part Details for LMP7709MT/NOPB
LMP7709MT/NOPB CAD Models
LMP7709MT/NOPB Part Data Attributes
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LMP7709MT/NOPB
National Semiconductor Corporation
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Datasheet
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LMP7709MT/NOPB
National Semiconductor Corporation
Operational Amplifier, 4 Func, 520uV Offset-Max, CMOS, PDSO14
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Reach Compliance Code | compliant | |
Amplifier Type | OPERATIONAL AMPLIFIER | |
Architecture | VOLTAGE-FEEDBACK | |
Frequency Compensation | YES | |
Input Offset Voltage-Max | 520 µV | |
JESD-30 Code | R-PDSO-G14 | |
JESD-609 Code | e3 | |
Low-Bias | YES | |
Low-Offset | YES | |
Micropower | NO | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 4 | |
Number of Terminals | 14 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP14,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | RAIL | |
Peak Reflow Temperature (Cel) | 260 | |
Power | NO | |
Programmable Power | NO | |
Qualification Status | Not Qualified | |
Slew Rate-Nom | 5.9 V/us | |
Supply Current-Max | 5 mA | |
Supply Voltage Limit-Max | 6.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Voltage Gain-Min | 50000 | |
Wideband | NO |