Part Details for LM3207TLX-2.53/NOPB by National Semiconductor Corporation
Overview of LM3207TLX-2.53/NOPB by National Semiconductor Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
DS96174CN/NOPB | Rochester Electronics LLC | DS96174 - Line Driver, 4 Func, 4 Driver, BIPolar, PDIP16 | |
LM611IM/NOPB | Rochester Electronics LLC | LM611IM - Operational Amplifier, 7000uV Offset-Max, BIPolar |
Part Details for LM3207TLX-2.53/NOPB
LM3207TLX-2.53/NOPB CAD Models
LM3207TLX-2.53/NOPB Part Data Attributes
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LM3207TLX-2.53/NOPB
National Semiconductor Corporation
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LM3207TLX-2.53/NOPB
National Semiconductor Corporation
IC 1.2 A SWITCHING REGULATOR, 2300 kHz SWITCHING FREQ-MAX, PBGA9, ROHS COMPLIANT, MICRO SMD, 9 PIN, Switching Regulator or Controller
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | VFBGA, BGA9,3X3,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Analog IC - Other Type | SWITCHING REGULATOR | |
Control Mode | CURRENT-MODE | |
Control Technique | PULSE WIDTH MODULATION | |
Input Voltage-Max | 5.5 V | |
Input Voltage-Min | 2.7 V | |
Input Voltage-Nom | 3.6 V | |
JESD-30 Code | S-PBGA-B9 | |
JESD-609 Code | e1 | |
Length | 1.97 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 9 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Output Current-Max | 1.2 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA9,3X3,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.675 mm | |
Surface Mount | YES | |
Switcher Configuration | BUCK | |
Switching Frequency-Max | 2300 kHz | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 1.97 mm |