Part Details for LM2608ATL-1.3/NOPB by Texas Instruments
Overview of LM2608ATL-1.3/NOPB by Texas Instruments
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Consumer Electronics
Part Details for LM2608ATL-1.3/NOPB
LM2608ATL-1.3/NOPB CAD Models
LM2608ATL-1.3/NOPB Part Data Attributes:
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LM2608ATL-1.3/NOPB
Texas Instruments
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Datasheet
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LM2608ATL-1.3/NOPB
Texas Instruments
IC,SMPS CONTROLLER,CURRENT/VOLTAGE,BGA,10PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | FBGA, BGA10,3X4,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Control Mode | CURRENT/VOLTAGE-MODE | |
JESD-30 Code | R-PBGA-B10 | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 10 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Output Current-Max | 0.45 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA10,3X4,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Switching Frequency-Max | 1000 kHz | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 |