There are no models available for this part yet.
Overview of LFSCM3GA115EP1-6FC1152I by Lattice Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Security and Surveillance
Industrial Automation
Financial Technology (Fintech)
Electronic Manufacturing
Communication and Networking
CAD Models for LFSCM3GA115EP1-6FC1152I by Lattice Semiconductor Corporation
Part Data Attributes for LFSCM3GA115EP1-6FC1152I by Lattice Semiconductor Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
BGA, BGA1152,34X34,40
|
Pin Count
|
1152
|
Reach Compliance Code
|
not_compliant
|
HTS Code
|
8542.39.00.01
|
Clock Frequency-Max
|
147.7 MHz
|
Combinatorial Delay of a CLB-Max
|
0.172 ns
|
JESD-30 Code
|
S-PBGA-B1152
|
JESD-609 Code
|
e0
|
Length
|
35 mm
|
Moisture Sensitivity Level
|
4
|
Number of CLBs
|
424
|
Number of Equivalent Gates
|
115000
|
Number of Inputs
|
660
|
Number of Logic Cells
|
115200
|
Number of Outputs
|
660
|
Number of Terminals
|
1152
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
424 CLBS, 115000 GATES
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA1152,34X34,40
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
225
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.2 mm
|
Supply Voltage-Max
|
1.26 V
|
Supply Voltage-Min
|
0.95 V
|
Supply Voltage-Nom
|
1.2 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
Tin/Lead (Sn63Pb37)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
35 mm
|
Alternate Parts for LFSCM3GA115EP1-6FC1152I
This table gives cross-reference parts and alternative options found for LFSCM3GA115EP1-6FC1152I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LFSCM3GA115EP1-6FC1152I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
LFSCM3GA115EP1-6FFN1152C | Field Programmable Gate Array, 424 CLBs, 115000 Gates, 1000MHz, 115200-Cell, CMOS, PBGA1152, 35 X 35 MM, LEAD FREE, FCBGA-1152 | Lattice Semiconductor Corporation | LFSCM3GA115EP1-6FC1152I vs LFSCM3GA115EP1-6FFN1152C |
LFSCM3GA115EP1-6FF1152C | Field Programmable Gate Array, 424 CLBs, 115000 Gates, 1000MHz, 115200-Cell, CMOS, PBGA1152, 35 X 35 MM, FCBGA-1152 | Lattice Semiconductor Corporation | LFSCM3GA115EP1-6FC1152I vs LFSCM3GA115EP1-6FF1152C |
LFSCM3GA115EP1-6FC1152C | Field Programmable Gate Array, 424 CLBs, 115000 Gates, 1000MHz, 115200-Cell, CMOS, PBGA1152, 35 X 35 MM, FCBGA-1152 | Lattice Semiconductor Corporation | LFSCM3GA115EP1-6FC1152I vs LFSCM3GA115EP1-6FC1152C |