Datasheets
LF355BJ by:

IC OP-AMP, 6500 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, CDIP14, CERAMIC, DIP-14, Operational Amplifier

Part Details for LF355BJ by National Semiconductor Corporation

Overview of LF355BJ by National Semiconductor Corporation

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for LF355BJ

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LF355BJ Part Data Attributes

LF355BJ National Semiconductor Corporation
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LF355BJ National Semiconductor Corporation IC OP-AMP, 6500 uV OFFSET-MAX, 2.5 MHz BAND WIDTH, CDIP14, CERAMIC, DIP-14, Operational Amplifier
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 80 dB
Common-mode Reject Ratio-Nom 100 dB
Frequency Compensation YES
Input Offset Voltage-Max 6500 µV
JESD-30 Code R-GDIP-T14
JESD-609 Code e0
Length 19.304 mm
Low-Bias YES
Low-Offset NO
Micropower NO
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1
Number of Terminals 14
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 5 V/us
Supply Current-Max 4 mA
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO
Technology BIPOLAR
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Unity Gain BW-Nom 2500
Voltage Gain-Min 25000
Width 7.62 mm

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