Part Details for LE77D112TC by Legerity
Results Overview of LE77D112TC by Legerity
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
LE77D112TC Information
LE77D112TC by Legerity is an Analog Transmission Interface.
Analog Transmission Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for LE77D112TC
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | TELECOM-SLIC, PQFP44 | 100 |
|
$7.2000 / $12.0000 | Buy Now |
|
|
Quest Components | TELECOM-SLIC, PQFP44 | 12 |
|
$12.0000 / $13.5000 | Buy Now |
Part Details for LE77D112TC
LE77D112TC CAD Models
LE77D112TC Part Data Attributes
|
|
LE77D112TC
Legerity
Buy Now
Datasheet
|
Compare Parts:
LE77D112TC
Legerity
SLIC, Bipolar, PQFP44, TQFP-44
Select a part to compare: |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LEGERITY INC | |
| Part Package Code | QFP | |
| Package Description | TQFP-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PQFP-G44 | |
| Length | 10 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 44 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Telecom IC Type | SLIC | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |
Alternate Parts for LE77D112TC
This table gives cross-reference parts and alternative options found for LE77D112TC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LE77D112TC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LE77D112TC | Microsemi Corporation | Check for Price | SLIC, Bipolar, PQFP44, TQFP-44 | LE77D112TC vs LE77D112TC |
LE77D112TC Frequently Asked Questions (FAQ)
-
Legerity recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital grounds separate. Additionally, it's essential to minimize the distance between the IC and the antenna, and to use a 50-ohm transmission line to connect the IC to the antenna.
-
To minimize power consumption, set the device to low-power mode (LPM) when not transmitting. Also, adjust the transmit power level to the minimum required for your application. Furthermore, consider using a power-saving mode during idle periods, and optimize the device's clock frequency to reduce power consumption.
-
The LE77D112TC is rated for operation from -40°C to +85°C. However, it's essential to ensure proper thermal management, especially in high-temperature environments, to prevent overheating and ensure reliable operation.
-
To troubleshoot RF performance issues, start by verifying the PCB layout and antenna design. Check for any signs of damage or corrosion on the IC or PCB. Use a spectrum analyzer to measure the transmitted signal and verify it meets the required specifications. Also, ensure that the device is properly configured and that the firmware is up-to-date.
-
Yes, the LE77D112TC can be used in a multi-module design. However, it's crucial to ensure that each module has its own dedicated antenna and that the modules are properly isolated to prevent interference. Additionally, consider using a module-specific configuration and calibration to optimize performance.