Part Details for L7C174PC12 by LOGIC Devices Inc
Overview of L7C174PC12 by LOGIC Devices Inc
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for L7C174PC12
L7C174PC12 CAD Models
L7C174PC12 Part Data Attributes
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L7C174PC12
LOGIC Devices Inc
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L7C174PC12
LOGIC Devices Inc
Cache Tag SRAM, 8KX8, 12ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LOGIC DEVICES INC | |
Part Package Code | DIP | |
Package Description | DIP, DIP28,.3 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 12 ns | |
Additional Feature | MATCH OUTPUT | |
JESD-30 Code | R-PDIP-T28 | |
JESD-609 Code | e0 | |
Length | 35.052 mm | |
Memory Density | 65536 bit | |
Memory IC Type | CACHE TAG SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.572 mm | |
Standby Current-Max | 0.0002 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.195 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |