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Part Details for L6362A by STMicroelectronics
Overview of L6362A by STMicroelectronics
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for L6362A
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
497-16410-ND
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DigiKey | IC TRANSCEIVER 1/1 12VFDFPN Min Qty: 2940 Lead time: 52 Weeks Container: Tray | Temporarily Out of Stock |
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$1.3728 | Buy Now |
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DISTI #
L6362A
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Avnet Silica | IO-Link Communication Transceiver 1TX 1RX 12-Pin DFN Tray (Alt: L6362A) RoHS: Compliant Min Qty: 490 Package Multiple: 490 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Win Source Electronics | IC TRANSCEIVER 1/1 12VFDFPN | 57237 |
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$2.4500 / $3.6740 | Buy Now |
Part Details for L6362A
L6362A CAD Models
L6362A Part Data Attributes
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L6362A
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
L6362A
STMicroelectronics
IO-Link communication transceiver device IC
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| JESD-30 Code | S-PDSO-N12 | |
| Length | 3 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 12 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 24 V | |
| Surface Mount | YES | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.45 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm |
Alternate Parts for L6362A
This table gives cross-reference parts and alternative options found for L6362A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L6362A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| L6362ATR | STMicroelectronics | $2.3260 | IO-Link communication transceiver device IC | L6362A vs L6362ATR |
| TLIN2021DRBRQ1 | Texas Instruments | $0.6921 | Automotive local interconnect network (LIN) transceiver with WAKE/INH and 58V bus fault protection 8-SON -40 to 125 | L6362A vs TLIN2021DRBRQ1 |
| TLIN1022DRQ1 | Texas Instruments | $1.2794 | Dual Local Interconnect Network (LIN) Transceiver With Dominant State Timeout 14-SOIC -40 to 125 | L6362A vs TLIN1022DRQ1 |
Resources and Additional Insights for L6362A
Reference Designs related to L6362A
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IO-Link for Industrial Sensors
This self-contained and ready-to-use modern industrial sensor solution implements multi-sensing functionality with embedded LSM6DSL 3D accelerometer and 3D gyroscope, LSM303AGR 3D accelerometer and 3D magnetometer, LPS22HB pressure sensor, and HTS221 humidity and temperature sensors, along with the L6362A physical IO-Link transceiver and STM32L073RZT6 microcontroller hosting the relevant protocol stack.<p>The node complies with the definition of an IO-Link device according to the provisioning protocols defined by the standard and facilitates expansion with additional sensors to extend the range of data supplied by the node.<p>The architecture represents a smart sensor node capable of monitoring equipment status, with all the benefits of the IO-Link industrial communication standard, including automatic node configuration, hot plug automatic device recognition, and several diagnostics features
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Sensor node with IO-Link device stack for predictive maintenance and condition monitoring
This compact, all-in-one, smart industrial sensor node for condition monitoring and predictive maintenance applications represents a fully featured turn-key solution with advanced sensing ICs and real-time local processing on a performance MCU with IO-Link protocol stack for data transmission via the L6362A PHY transceiver.<p>The solution combines some of ST’s latest generation MEMS sensors such as the wide bandwidth IIS3DWB digital vibration sensor with the powerful digital signal processing capabilities of the STM32F469 microcontroller on a single node that can be attached at appropriate locations on monitored industrial equipment. This smart sensor – MCU combination on the same node allows the immediate transformation of raw sensor data into valuable analytical data on which condition monitoring and predictive maintenance platform applications can operate.<p>The node is a fully compliant IO-Link network device complete with L6362A transceiver, device description file and IO-Link protocol stack through which the STM32F4 series MCU manages and negotiate node and transmission parameters according to the industrial communication standard.