Part Details for KMFN60012M-B214 by Samsung Electronics Co. Ltd
Overview of KMFN60012M-B214 by Samsung Electronics Co. Ltd
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 10155552-B214KLF | Amphenol Communications Solutions | Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (postplated) | |
| 10155550-B214KLF | Amphenol Communications Solutions | Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Right angle, 14 position, Tin (postplated) | |
| 10155500-B214KLF | Amphenol Communications Solutions | Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Right angle, 14 Position, STG, Top Latch, Tin (postplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>) |
Price & Stock for KMFN60012M-B214
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
KMFN60012M-B214
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EBV Elektronik | Multi Chip Package Memory eMMC5.1 LPDDR3 SDRAM 8Gb (Alt: KMFN60012M-B214) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks, 0 Days | EBV - 0 |
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