Part Details for K8D1716UTC-DI07T by Samsung Semiconductor
Overview of K8D1716UTC-DI07T by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for K8D1716UTC-DI07T
K8D1716UTC-DI07T CAD Models
K8D1716UTC-DI07T Part Data Attributes
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K8D1716UTC-DI07T
Samsung Semiconductor
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Datasheet
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K8D1716UTC-DI07T
Samsung Semiconductor
Flash, 1MX16, 70ns, PBGA48
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | FBGA, BGA48,6X8,32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 70 ns | |
Alternate Memory Width | 8 | |
Boot Block | TOP | |
Command User Interface | YES | |
Common Flash Interface | YES | |
Data Polling | YES | |
JESD-30 Code | R-PBGA-B48 | |
JESD-609 Code | e1 | |
Memory Density | 16777216 bit | |
Memory IC Type | FLASH | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Sectors/Size | 8,31 | |
Number of Terminals | 48 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA48,6X8,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Ready/Busy | YES | |
Sector Size | 8K,64K | |
Standby Current-Max | 0.000018 A | |
Supply Current-Max | 0.05 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Toggle Bit | YES | |
Type | NOR TYPE |
Alternate Parts for K8D1716UTC-DI07T
This table gives cross-reference parts and alternative options found for K8D1716UTC-DI07T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K8D1716UTC-DI07T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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K8D1716UTC-FI07 | Flash, 1MX16, 70ns, PBGA48, FBGA-48 | Samsung Semiconductor | K8D1716UTC-DI07T vs K8D1716UTC-FI07 |
K8D1716UTC-FI070 | Flash, 1MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, TBGA-48 | Samsung Semiconductor | K8D1716UTC-DI07T vs K8D1716UTC-FI070 |
K8D1716UTC-DI070 | Flash, 1MX16, 70ns, PBGA48, 6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48 | Samsung Semiconductor | K8D1716UTC-DI07T vs K8D1716UTC-DI070 |