There are no models available for this part yet.
Overview of K7D803671C-HC30 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 54HC30FK/B | Rochester Electronics LLC | Replacement for Texas Instruments part number SNJ54HC30FK. Buy from authorized manufacturer Rochester Electronics. | |
| 54HC30/BCA | Rochester Electronics LLC | 54HC30 - 8-Input NAND Gates - Dual marked (M38510/65004BCA) | |
| 74HC30FPEL-E | Renesas Electronics Corporation | HD/RD74HC Series |
CAD Models for K7D803671C-HC30 by Samsung Semiconductor
Part Data Attributes for K7D803671C-HC30 by Samsung Semiconductor
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
|
Package Description
|
BGA, BGA153,9X17,50
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
1.9 ns
|
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B153
|
|
JESD-609 Code
|
e0
|
|
Memory Density
|
9437184 bit
|
|
Memory IC Type
|
STANDARD SRAM
|
|
Memory Width
|
36
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
153
|
|
Number of Words
|
262144 words
|
|
Number of Words Code
|
256000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
256KX36
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA153,9X17,50
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Standby Current-Max
|
0.1 A
|
|
Standby Voltage-Min
|
2.37 V
|
|
Supply Current-Max
|
0.4 mA
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
BOTTOM
|
Alternate Parts for K7D803671C-HC30
This table gives cross-reference parts and alternative options found for K7D803671C-HC30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7D803671C-HC30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IBM0436A8CFLBB-3P | Standard SRAM, 256KX36, 1.7ns, CMOS, PBGA153, BGA-153 | IBM | K7D803671C-HC30 vs IBM0436A8CFLBB-3P |
| MCM64E836FC3.3R | 256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Freescale Semiconductor | K7D803671C-HC30 vs MCM64E836FC3.3R |
| MCM64E836FC4.0 | 256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Freescale Semiconductor | K7D803671C-HC30 vs MCM64E836FC4.0 |
| MCM64E836FC5.0R | 256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | K7D803671C-HC30 vs MCM64E836FC5.0R |
| IBM0436A8CBLBB-5 | Standard SRAM, 256KX36, 2.5ns, CMOS, PBGA153, BGA-153 | IBM | K7D803671C-HC30 vs IBM0436A8CBLBB-5 |
| IBM04368CBLBC-28 | Standard SRAM, 256KX36, 1.8ns, CMOS, PBGA153, BGA-153 | IBM | K7D803671C-HC30 vs IBM04368CBLBC-28 |
| MCM64E836RS4.4 | DDR SRAM, 256KX36, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | K7D803671C-HC30 vs MCM64E836RS4.4 |
| MCM64E836FC4.0R | IC,SYNC SRAM,SDR/DDR,256KX36,CMOS,BGA,153PIN,PLASTIC | Freescale Semiconductor | K7D803671C-HC30 vs MCM64E836FC4.0R |
| MCM64E836RS4.0R | 256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | K7D803671C-HC30 vs MCM64E836RS4.0R |
| MCM64E836FC4.4 | 256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | K7D803671C-HC30 vs MCM64E836FC4.4 |