There are no models available for this part yet.
Overview of K4W2G1646C-HC12 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Education and Research
Computing and Data Storage
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
MM74HC123AN-G | Rochester Electronics LLC | 74HC123 - Monostable Multivibrator, HC/UH Series, 2-Func | |
0603HC-12NXJLW | Coilcraft Inc | General Purpose Inductor, 0.012uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT | |
0603HC-12NXJLU | Coilcraft Inc | General Purpose Inductor, 0.012uH, 5%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT |
Price & Stock for K4W2G1646C-HC12 by Samsung Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | 8 |
|
RFQ |
CAD Models for K4W2G1646C-HC12 by Samsung Semiconductor
Part Data Attributes for K4W2G1646C-HC12 by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.36
|
Access Time-Max
|
0.225 ns
|
Clock Frequency-Max (fCLK)
|
800 MHz
|
I/O Type
|
COMMON
|
Interleaved Burst Length
|
8
|
JESD-30 Code
|
R-PBGA-B96
|
Memory Density
|
2147483648 bit
|
Memory IC Type
|
GDDR3 DRAM
|
Memory Width
|
16
|
Number of Terminals
|
96
|
Number of Words
|
134217728 words
|
Number of Words Code
|
128000000
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
|
Organization
|
128MX16
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
FBGA
|
Package Equivalence Code
|
BGA96,9X16,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Refresh Cycles
|
8192
|
Sequential Burst Length
|
8
|
Standby Current-Max
|
0.012 A
|
Supply Current-Max
|
0.27 mA
|
Supply Voltage-Nom (Vsup)
|
1.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|