Part Details for K4S56163LF-XG75 by Samsung Semiconductor
Overview of K4S56163LF-XG75 by Samsung Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for K4S56163LF-XG75
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 16MX16 SYNCHRONOUS DRAM, 5.4NS, PBGA54 | 1735 |
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$5.8000 / $11.6000 | Buy Now |
Part Details for K4S56163LF-XG75
K4S56163LF-XG75 CAD Models
K4S56163LF-XG75 Part Data Attributes
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K4S56163LF-XG75
Samsung Semiconductor
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Datasheet
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K4S56163LF-XG75
Samsung Semiconductor
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54
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Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Access Time-Max | 5.4 ns | |
Clock Frequency-Max (fCLK) | 133 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 1,2,4,8 | |
JESD-30 Code | S-PBGA-B54 | |
JESD-609 Code | e0 | |
Memory Density | 268435456 bit | |
Memory IC Type | SYNCHRONOUS DRAM | |
Memory Width | 16 | |
Number of Terminals | 54 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Organization | 16MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA54,9X9,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Sequential Burst Length | 1,2,4,8,FP | |
Standby Current-Max | 0.0005 A | |
Supply Current-Max | 0.165 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |