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Power Circuits / Power Management Circuits / ISPPAC-POWR607-01NN32I
Datasheets
ISPPAC-POWR607-01NN32I by: Lattice Semiconductor Corporation

Power Supply Management Circuit, Adjustable, 6 Channel, CMOS, LEAD FREE, QFN-32

Part Details for ISPPAC-POWR607-01NN32I by Lattice Semiconductor Corporation

Results Overview of ISPPAC-POWR607-01NN32I by Lattice Semiconductor Corporation

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

ISPPAC-POWR607-01NN32I Information

ISPPAC-POWR607-01NN32I by Lattice Semiconductor Corporation is a Power Management Circuit.
Power Management Circuits are under the broader part category of Power Circuits.

A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.

Price & Stock for ISPPAC-POWR607-01NN32I

Part # Distributor Description Stock Price Buy
Bristol Electronics   33
RFQ
Quest Components POWER SUPPLY MANAGEMENT CIRCUIT, ADJUSTABLE, 6 CHANNEL, CMOS 26
  • 1 $7.8600
  • 5 $5.7640
  • 14 $5.2400
$5.2400 / $7.8600 Buy Now

Part Details for ISPPAC-POWR607-01NN32I

ISPPAC-POWR607-01NN32I CAD Models

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ISPPAC-POWR607-01NN32I Part Data Attributes

Parametric Data
ISPPAC-POWR607-01NN32I Lattice Semiconductor Corporation
Buy Now Datasheet
Compare Parts:
ISPPAC-POWR607-01NN32I Lattice Semiconductor Corporation Power Supply Management Circuit, Adjustable, 6 Channel, CMOS, LEAD FREE, QFN-32
Select a part to compare:
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP
Part Package Code QFN
Package Description LEAD FREE, QFN-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Lattice Semiconductor
Additional Feature BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:Y;WWD:N
Adjustable Threshold YES
Analog IC - Other Type VOLTAGE SUPERVISOR
JESD-30 Code S-XQCC-N32
JESD-609 Code e3
Length 5 mm
Moisture Sensitivity Level 1
Number of Channels 6
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Equivalence Code LCC32,.2SQ,20
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Current-Max (Isup) 5 mA
Supply Voltage-Max (Vsup) 3.96 V
Supply Voltage-Min (Vsup) 2.64 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 5 mm

Alternate Parts for ISPPAC-POWR607-01NN32I

This table gives cross-reference parts and alternative options found for ISPPAC-POWR607-01NN32I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ISPPAC-POWR607-01NN32I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MAX16055HAUB+ Maxim Integrated Products $5.0384 Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055HAUB+
MAX16055CAUB+ Analog Devices Inc Check for Price Ultra-Small, Hex Voltage, Microprocessor Supervisor, 10-MINI_SO-N/A, 10 Pins, -40 to 125C ISPPAC-POWR607-01NN32I vs MAX16055CAUB+
MAX16055EAUB+ Maxim Integrated Products Check for Price Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055EAUB+
MAX16055CAUB+ Maxim Integrated Products $5.0384 Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055CAUB+
MAX16055DAUB+ Maxim Integrated Products Check for Price Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055DAUB+
MAX16055HAUB+ Analog Devices Inc Check for Price Ultra-Small, Hex Voltage, Microprocessor Supervisor, 10-MINI_SO-N/A, 10 Pins, -40 to 125C ISPPAC-POWR607-01NN32I vs MAX16055HAUB+
ISPPAC-POWR607-01NN32I1 Lattice Semiconductor Corporation Check for Price Power Supply Support Circuit, LEAD FREE, QFNS-32 ISPPAC-POWR607-01NN32I vs ISPPAC-POWR607-01NN32I1
MAX16055FAUB+ Maxim Integrated Products $3.4858 Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055FAUB+
MAX16055FAUB+ Analog Devices Inc Check for Price Ultra-Small, Hex Voltage, Microprocessor Supervisor, 10-MINI_SO-N/A, 10 Pins, -40 to 125C ISPPAC-POWR607-01NN32I vs MAX16055FAUB+
MAX16055GAUB+ Maxim Integrated Products Check for Price Power Supply Management Circuit, Adjustable, 6 Channel, BICMOS, PDSO10, 3 X 3 MM, ROHS COMPLIANT, UMAX-10 ISPPAC-POWR607-01NN32I vs MAX16055GAUB+

ISPPAC-POWR607-01NN32I Related Parts

ISPPAC-POWR607-01NN32I Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the PCB layer stack-up symmetrical. Additionally, it's recommended to use a thermal pad on the bottom of the device and connect it to a thermal plane or a heat sink.

  • To ensure reliable power-up and power-down sequencing, it's recommended to follow the power-up and power-down sequencing guidelines provided in the datasheet. This typically involves powering up the VCC and VCCA pins simultaneously, followed by the VCCIO pin, and then the input signals. During power-down, the sequence should be reversed.

  • To mitigate EMI and RFI, it's recommended to use a multi-layer PCB with a solid ground plane, keep signal traces short and away from the device's power pins, and use shielding or filtering on sensitive signals. Additionally, the device's power pins should be decoupled with capacitors and the PCB should be designed to minimize radiation.

  • To optimize the device's power consumption, it's recommended to use the lowest possible voltage supply, minimize the clock frequency, and use the device's power-saving features such as dynamic voltage and frequency scaling. Additionally, the device's idle mode can be used to reduce power consumption when it's not actively switching.

  • For high-reliability applications, it's recommended to follow the device's recommended operating conditions, use a robust PCB design with adequate thermal management, and implement error detection and correction mechanisms. Additionally, the device's configuration and programming should be verified and validated to ensure correct operation.