Datasheets
ISL54225IRUZ-T7A by:
Intersil Corporation
Intersil Corporation
Renesas Electronics Corporation
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High-Speed USB 2.0 (480Mbps) Multiplexer with Overvoltage Protection (OVP); DFN10, uTQFN10; Temp Range: -40° to 85°C

Part Details for ISL54225IRUZ-T7A by Intersil Corporation

Results Overview of ISL54225IRUZ-T7A by Intersil Corporation

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ISL54225IRUZ-T7A Information

ISL54225IRUZ-T7A by Intersil Corporation is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
ISL54225IRUZ-T Renesas Electronics Corporation High-Speed USB 2.0 (480Mbps) Multiplexer with Overvoltage Protection (OVP)
ISL54225IRUZ-T7A Renesas Electronics Corporation High-Speed USB 2.0 (480Mbps) Multiplexer with Overvoltage Protection (OVP)

Part Details for ISL54225IRUZ-T7A

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ISL54225IRUZ-T7A Part Data Attributes

ISL54225IRUZ-T7A Intersil Corporation
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ISL54225IRUZ-T7A Intersil Corporation High-Speed USB 2.0 (480Mbps) Multiplexer with Overvoltage Protection (OVP); DFN10, uTQFN10; Temp Range: -40° to 85°C
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Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer INTERSIL CORP
Part Package Code DFN, uTQFN
Package Description 1.80 X 1.40 MM, ROHS COMPLIANT, PLASTIC, MO-255, UTQFN-10
Pin Count 10, 10
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Factory Lead Time 26 Weeks
Analog IC - Other Type SPDT
JESD-30 Code R-PQCC-N10
JESD-609 Code e4
Length 1.8 mm
Moisture Sensitivity Level 1
Number of Functions 2
Number of Terminals 10
On-state Resistance-Max (Ron) 25 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY
Package Code QCCN
Package Equivalence Code LCC10,.06X.07,16
Package Shape RECTANGULAR
Package Style CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 0.55 mm
Surface Mount YES
Switching BREAK-BEFORE-MAKE
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD
Terminal Pitch 0.4 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 1.4 mm

ISL54225IRUZ-T7A Related Parts

ISL54225IRUZ-T7A Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal performance involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

  • To ensure reliable operation over the entire operating temperature range, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding thermal gradients. Additionally, it's recommended to operate the device within the specified operating temperature range and to avoid exceeding the maximum junction temperature.

  • The ISL54225IRUZ-T7A has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-protected packaging. Additionally, it's recommended to use ESD protection devices, such as TVS diodes, on the input and output lines.

  • To troubleshoot issues with the ISL54225IRUZ-T7A, it's recommended to follow a systematic approach, starting with a visual inspection of the PCB and device. Check for signs of physical damage, soldering issues, or component failure. Use oscilloscopes and logic analyzers to verify signal integrity and timing. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

  • When using the ISL54225IRUZ-T7A in a high-reliability application, it's essential to follow a rigorous design and testing process. This includes performing thorough component selection and qualification, using a robust PCB design, and implementing comprehensive testing and validation procedures. Additionally, it's recommended to consider using redundant or fault-tolerant designs, and to implement error detection and correction mechanisms.