Part Details for IS66WVH32M8DALL-200B1LI by Integrated Silicon Solution Inc
Results Overview of IS66WVH32M8DALL-200B1LI by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
IS66WVH32M8DALL-200B1LI Information
IS66WVH32M8DALL-200B1LI by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS66WVH32M8DALL-200B1LI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS66WVH32M8DALL-200B1LI
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Avnet Asia | PSRAM Sync 256Mbit 32M X 8 40ns 24-Pin TFBGA (Alt: IS66WVH32M8DALL-200B1LI) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
IS66WVH32M8DALL-200B1LI
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Avnet Silica | PSRAM Sync 256Mbit 32M X 8 40ns 24Pin TFBGA (Alt: IS66WVH32M8DALL-200B1LI) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 28 Weeks, 0 Days | Silica - 0 |
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Part Details for IS66WVH32M8DALL-200B1LI
IS66WVH32M8DALL-200B1LI CAD Models
IS66WVH32M8DALL-200B1LI Part Data Attributes
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IS66WVH32M8DALL-200B1LI
Integrated Silicon Solution Inc
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Datasheet
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IS66WVH32M8DALL-200B1LI
Integrated Silicon Solution Inc
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Date Of Intro | 2020-04-12 | |
| Access Time-Max | 35 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | PSEUDO STATIC RAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00002 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 6 mm |